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India-EU Seal Semiconductor Collaboration with Groundbreaking MoU on Research and Innovation

India and the European Union have inked a Memorandum of Understanding (MoU) on semiconductor collaboration, spanning research, innovation, talent development, partnerships, and market information exchange. The agreement was formalized ahead of the India EU Trade and Technology Council, co-chaired virtually by India’s External Affairs Minister S Jaishankar, Minister of Commerce and Industry Piyush Goyal, and Minister of Electronics and Information Technology Ashwini Vaishnaw, along with European counterparts Executive Vice-President Valdis Dombrovskis and Vice-President Vera Jourova. The MoU focuses on bolstering the semiconductor value chain’s resilience in both India and the EU, emphasizing collaboration in research, innovation, talent development, and information exchange. This underscores a commitment to fortifying semiconductor supply chains and fostering joint innovation initiatives between India and the EU. The co-chairs affirmed their satisfaction with progress in various working groups, emphasizing the need for practical outcomes and projects through intensified stakeholder consultations before the next council meeting and India-EU Summit.

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Written by RT team

The RT team is a diverse group of writers, analysts, and innovation enthusiasts united by a shared passion for the world of invention. With a collective experience spanning several years in technology, science, journalism, and innovation studies, they dedicate their skills to uncovering, understanding, and showcasing the most exciting advancements and trends in the industry.