RT team
A team of 30 scientists from the Indian Institute of Science (IISc) has submitted a detailed project report (DPR) to the government, proposing the development of angstrom-scale chips using innovative 2D semiconductor materials. This technology promises to create chips up to ten times smaller than the smallest silicon-based chips currently in production, potentially revolutionizing India’s semiconductor industry.
The DPR, revised and resubmitted in October 2024, highlights the use of materials like graphene and transition metal dichalcogenides (TMDs). These ultra-thin 2D materials can achieve unprecedented miniaturization, moving beyond the current 3-nanometer node manufactured by global leaders like Samsung and MediaTek.
India’s semiconductor industry heavily depends on foreign suppliers, making this proposal a significant step towards self-reliance. Unlike the Rs 91,000 crore Tata-PSMC project under the India Semiconductor Mission, the IISc proposal requests Rs 500 crore over five years to establish indigenous capabilities. The project also includes a plan for self-sustainability after the initial funding.
Globally, countries like South Korea and Europe have made substantial investments in 2D semiconductor research, while India lags behind despite recognizing the technology’s strategic importance. The Ministry of Electronics and IT (MeitY) has shown interest, with discussions and evaluations underway.
Experts urge swift action, emphasizing the urgency of adopting 2D materials as the semiconductor industry approaches the limits of silicon-based technologies. With global momentum building, India’s timely execution could establish it as a leader in the post-silicon era.
